[Nagoya] Robodex -Robot [Development]/[Utilization] 2027
![[Nagoya] Robodex -Robot [Development]/[Utilization] Tokyo 2027](https://zh-tw.cantonfair.net/components/com_rseventspro/assets/images/events/thumbs/200/9c797d1d52d79f9d17cca060340d480b.jpg)
NEPCON JAPAN is Asia's premier exhibition for electronics R&D, manufacturing and packaging, held Feb 17‑19, 2027 at Tokyo Big Sight. The show expects ~1,800 exhibitors and 88,000 visitors and is organized into eight specialized expos covering the full electronics production chain: Power Device & Module Expo (power semiconductors and modules), IC & Sensor Packaging Expo (advanced IC and sensor packaging), PWB Expo (printed wiring board manufacturing), Electronic Components & Materials Expo (components and raw materials), Fine Process Technology Expo (precision processing), EMS & ODM Expo (contract manufacturing services), Electrotest Japan (testing and measurement), and InterNEPCON Japan (industry networking). The event features technical conferences, product demos, and business matchmaking for professionals involved in design, production, and supply‑chain activities.