IC & センサー包装技術展 2027
從 2027年2月17日 開始，到 2027年2月19日 結束
At 東京 – 日本東京的東京ビッグサイト ( 查看地圖)
(請在參加之前，再次確認以下組織者所提供的日期和地點是否正確。)
IC感測器包裝技術展覽會 (ISP)
Recognized as Asia’s leading exhibition for IC final manufacturing, the IC Sensor Packaging Expo gathers advanced equipment, materials, and services essential to the industry. The event is a key part of the NEPCON JAPAN series, featuring a technical conference planned by industry-leading experts.
The expo focuses on the latest innovations and technologies in IC and sensor packaging. Key exhibits and categories include:
- IC final manufacturing equipment
- Advanced sensor packaging technologies
- Materials and services for IC manufacturing
ISP is co-located with several major industry events, providing a comprehensive overview of the electronics manufacturing supply chain:
| 同時舉辦的活動/演出 |
|---|
| インターネプコン・ジャパン |
| エレクトロテスト・ジャパン |
| 電子元件及材料展覽會 |
| PWB EXPO |
| 精緻加工技術展覽會 |
| 電力設備與模組展覽會 |
| EMS & ODM展覽會 |
請註冊以參加活動或擁有攤位。
請至 IC & SENSOR PACKAGING TECHNOLOGY EXPO 的組織者網站上進行註冊。