DesignCon 2027 | February 2–4 | Santa Clara, CA | Premier Engineering & Design Conference 2027
DesignCon Overview
DesignCon is the premier high-speed communications and system design conference and exposition for chip, board, and systems design engineers. It offers industry-critical engineering education and showcases the latest tools, trends, and technologies in the heart of Silicon Valley.
會議計劃
The expertly curated 15-track conference features technical paper sessions, tutorials, and industry panels covering all aspects of electronic design. Key topics include:
- Signal and power integrity
- High-speed link design
- Machine learning applications
- Chip, board, and systems design
博覽會的亮點
The expo hall hosts hundreds of new products and technologies, providing interactive demos and networking opportunities with top suppliers. Key features include:
- Chiphead Theater educational sessions
- Keynote presentations by industry visionaries
- 實際的產品演示
獎勵/表彰
DesignCon recognizes excellence through several awards, most notably the Engineer of the Year Award, which honors leadership and creativity in the design and test of chips, boards, or systems, with a focus on signal and power integrity. Additional recognitions include Best Paper Awards and the 40 Under 40 program.